1U

1. Single socket H4 (LGA 1151) supports Intel® 6th Gen. Core i7/i5/i3 series, Intel® Celeron® and Intel® Pentium® processors 2. Intel® Q170 Express chipset 3. 2x 2.5" Fixed drive bays 4. Up to 64GB Unbuffered Non-ECC UDIMM DDR4 2133MHz; 4 DIMM slots 5. 1x PCI-E 3.0 x16 (in x16) slot 6. 1x GbE LAN w/ Intel® i210-AT, 1x GbE LAN w/ Intel® PHY i219LM 7. Integrated IPMI 2.0 and KVM with Dedicated LAN, vPro supported 8. 2x DP, 1 DVI-I, Intel HD Graphics, with 3x independent displays, VGA for BMC AST2400 9. 400W Platinum Level Power Supply + Optional 2nd redundant 400W Power supply or Battery Backup Unit

Single Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM (per node) 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node) Front-access 2000W AC Redundant Power Supplies (per system)

Supermicro SYS-5018D-MF 1. Single socket H3 (LGA 1150) supports Intel® Xeon® E3-1200 v3/v4, 4th gen. Core i3, Pentium, Celeron processors 2. Intel® C222 Express PCH 3. 2x Internal 3.5" SATA3/2 HDD bays (2.5" optional) 4. 1x PCI-E 3.0 x8 (in x16) Full-height slot 5. Up to 32GB DDR3 ECC 1600MHz UDIMMs in 4 sockets

• Space-efficient, compact design • Fast to build and deploy • Gateway, file-sharing, security 1. Intel® Atom processor C2750, SoC, FCBGA 1283, 20W 8-Core 2. Intel® System-on-Chip Design 3. 2x 3.5" Fixed SATA3 HDD bays or 4x 2.5" SATA2 HDD optional* 4. 1x PCI-E 2.0 x8 slot** 5. Up to 64GB DDR3 1600MHz ECC SO-DIMM in 4 DIMM slots 6. 4x GbE via Intel® C2000 SoC i354 (MACs) 7. DOM power connector 8. 200W Low-noise power supply w/ PFC

Intel® Xeon® Processor D-2796NT, CPU TDP 120W, Up to 256GB Registered ECC RDIMM, DDR4-3200MHz, Up to 512GB LRDIMM LRDIMM, DDR4-3200MHz, in 4 DIMM slots 2x Internal 2.5" drive bays (2x PCI-E 4.0 NVMe x8 SlimSAS and 1x OCuLink options)

Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR4-3200: RDIMM/LRDIMM (per node) 2 PCIe Gen4 x16 FHHL slot and 1 PCIe Gen4 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node)

1. Intel® Xeon® D-2177NT Processor, 14-Core, 28 Threads, 1.9 GHz, 105W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2666Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 (FHFL) slots 4. 2 Hot-swap 2.5" drive bays, 2 Internal 2.5" SSD bays 5. 1 M-Key, 2280/22110, 1 E-Key, 2230, 1 B-Key, 3042