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Hewlett Packard Enterprise MSA 1050. Rack (2U). 24, Supported storage types: HDD, Supported storage interfaces: SAS, Supported storage drive size: 2.5". 495 mm width, 447 mm depth, 89 mm height, 17.6 kg weight.

1. 200 CPUs per 42U Rack 2. Quad socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 3. Intel® C622 chipset 4. 4 Hot-plug 2.5" NVMe/SAS3/SATA3 drive bays and 2 M.2 NVMe/SATA 5. 48 DDR4 LRDIMM/RDIMM slots 6. Dual 10G onboard and/or 100G EDR InfiniBand/ Intel Omni-Path (Mezzanine card) 7. IPMI 2.0, KVM over IP, Virtual Media over LAN 8. Graphics: Aspeed AST2500 BMC

Dual Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors,supports up to 300W TDP 16 DIMM slots, Up to 4TB DDR5-4800MHz ECC Registered RDIMM 4 PCIe 5.0 x16 Low Profile (LP), 2 PCIe 5.0 x8 Low Profile (LP) 1200W Redundant Titanium level Power Supplies

Supports up to 10 x Dual slot Gen5 GPU cards AMD EPYC™ 9004 series processors AMD EPYC™ 9004 series processors with AMD 3D V-Cache™ Technology Dual processor, 5nm technology 12-Channel RDIMM DDR5, 48 x DIMMs Dual ROM Architecture 2 x 1Gb/s BASE-T LAN ports (Intel® I350-AM2) 1 x Dedicated management port 8 x 2.5" Gen5 NVMe/SATA hot-swappable bays 4 x 2.5" SATA hot-swappable bays

Single AMD EPYC™ 7002/7003 Series Processor, 16 DIMMs; up to 4TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM, 4 PCI-E 4.0 x16 (FH, 10.5" L) slots, 2 AIOM slots, Integrated IPMI 2.0 + KVM with dedicated LAN, 12 Hot-swap 3.5" SATA3/SAS3/NVMe drive bays, Optional 2x 2.5" peripheral drive bays viarear drive bay kits, M.2 Interface: 2 PCI-E 3.0 x4 M.2 Form Factor: 2242, 2260, 2280, 22110 M.2 Key: M-Key 2 USB 3.0 ports (rear),1 VGA, 1 COM, 920W Redundant Platinum Level Power Supplies

Intel BDW-DE 16 Core ( 2 Nodes Per Sled ) with Package.

Single AMD socket, 225W, DDR4 3200, 16 DIMM, 4 3.5"/2.5", 1 M.2, Intel i350 1Gb x2, 2 PCI

1U Rackmount with 1+1 Platinum 750W Slim PSU Single Socket E (LGA 4677), supports 4th Gen Intel® Xeon® Scalable processors 8 DIMM slots (1DPC), supports DDR5 RDIMM/ RDIMM-3DS 4 Hot-swap 2.5" NVMe (PCIe5.0 x4)/SATA/SAS* drive bays, 4 Hot-swap 3.5" SATA drive bays 1 FHHL PCIe5.0 x16 Supports 1 M.2 (PCIe3.0 x4) 2 RJ45 (10GbE) by Intel® X550 Remote management (IPMI)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIOM )

Supports up to 3 x dual slot Gen5 GPU cards 4th Gen Intel® Xeon® Scalable Processors Intel® Xeon® CPU Max Series Single processor, LGA 4677 8-Channel RDIMM DDR5 per processor, 16 x DIMMs Dual ROM Architecture supported 1 x 1Gb/s LAN port (Intel® I210-AT) 1 x Dedicated management port 12 x 3.5"/2.5" SATA hot-swappable bays

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support

Seagate® Exos® AP 4U100 has the datasphere’s highest density of compute and storage in a single system.