Hyper

Počet jadier: 40 Počet vlákien: 80 Frekvencia: 2.30 Ghz Max frekvencia turba: 3.40 Ghz Pamäť L3 Cache: 60 MB TDP: 270 W

Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors 32 DIMM slots supporting up to 8TB of memory; RDIMMs up to DDR5-5600 Optional PCIe slot configurations up to 8 PCIe 5.0 x8 or 4 PCIe 5.0 x16 slots with support for double-width GPU/Accelerator cards Flexible networking options with up to 2 AIOM networking slots (OCP NIC 3.0 compatible) 4 heavy duty hot-swap fans with optimal fan speed control

Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series Configurable PCI-E slot options up to 8 PCI-E 4.0 x8 or 4 PCI-E 4.0 x16 slots with support for double-width GPU/Accelerator cards Flexible networking options with 2 AIOM networking slot (OCP NIC 3.0 compatible) 12x 3.5" hot-swap NVMe/SATA/SAS drive bays; 2x internal M.2 NVMe/SATA drive slots; Optional RAID support via storage add-on card 4 heavy duty hot-swap fans with optimal fan speed control

4th Generation AMD EPYC™ 9004 Series Processors ASPEED AST2600 24 x DIMM slots, DDR5 -4800 memory support up to 6 TB 1 AIOM/OCP NIC 3.0 Slots with up to 2 AIOM/OCP with additional kits Configuration Options for up to 4 PCI-E 5.0 x16 Slots Configuration Options for up to 8 PCI-E 5.0 x8 Slots 12 Hot-swap 3.5” NVMe/SAS/SATA (Optional parts required for NVMe/SAS/SATA configurations) 2 On-board Gen 3 M.2 NVMe 80mm/110mm (Boot) *Full redundancy based on configuration and application load 1600W Redundant Power Supplies (Titanium Level)

Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series Configurable PCI-E slot options up to 8 PCI-E 4.0 x8 or 4 PCI-E 4.0 x16 slots with support for double-width GPU/Accelerator cards Flexible networking options with up to 2 AIOM networking slots (OCP NIC 3.0 compatible) 24x 2.5" hot-swap NVMe/SATA/SAS drive bays; 2x internal M.2 NVMe/SATA drive slots; Optional RAID support via storage add-on card 4 heavy duty hot-swap fans with optimal fan speed control

4th Generation AMD EPYC™ 9004 Series Processors ASPEED AST2600 24 x DIMM slots, DDR5 -4800 memory support up to 6 TB 1 PCI-E 5.0 x16, FH, 6.6"L 2 PCI-E 5.0 x16 FH, 10.5"L Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible) 2 On-board PCI-E 3.0 x4 M.2 NVMe 80mm/110mm (Boot) 8 Hot-swap 2.5” NVMe/SAS/SATA2 (Option for up to 12 drives) 800/1200W Redundant Power Supplies (Titanium Level) (*Full redundancy based on configuration and application load) 1 VGA Port 2 USB rear + 1 USB front

Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series 3 PCI-E 4.0 x16 slots with support for GPU/Accelerator cards Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible) 8x 2.5" hot-swap NVMe/SATA/SAS drive bays; Optional 4x 2.5" hot-swap NVMe/SAS/SATA drive bays; 2x internal M.2 NVMe/SATA drive slots; Optional RAID support via storage add-on card 8 heavy duty hot-swap fans with optimal fan speed control

4th Generation AMD EPYC™ 9004 Series Processors ASPEED AST2600 24 x DIMM slots, DDR5 -4800 memory support up to 6 TB 1 AIOM/OCP NIC 3.0 Slots with up to 2 AIOM/OCP with additional kits Configuration Options for up to 4 PCI-E 5.0 x16 Slots Configuration Options for up to 8 PCI-E 5.0 x8 Slots 2 On-board Gen 3 M.2 NVMe 80mm/110mm (Boot) 24 Hot-swap 2.5” NVMe/SAS/SATA (Optional parts required for NVMe/SAS/SATA configurations) *Full redundancy based on configuration and application load 1600W Redundant Power Supplies (Titanium Level)

Hyper 1U, 8x2.5", X13DEM, HS119-R1K24P2.