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1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card support (flexible networking) Note: must bundle with Network card

1. High Availability Storage Appliance Platform 2. Redundant Hot-swap expander trays 3. 4 SAS3.0 IO ports 4. 16 Hot-swap 3.5" Drive Bays 5. IPMI 2.0 with dedicated LAN 6. 12x 40mm cooling fans 7. 1200W Redundant Power Supplies Titanium Level Certified

1. Single Node High density, 2 rear mirrored boot drives, 4 NVMe SSD drives for caching 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 60 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 controllers (IT Mode) or Broadcom 3916 (H/W RAID) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2000W Redundant Power Supplies Titanium Level (96%)

Dual socket 3rd Gen Intel® Xeon® Scalable processors, up to 72 Cores Per Node 16 ECC DDR4-3200: LRDIMM/RDIMM 3 x PCI-E 4.0 x16 HHHL PCI-E slots 90 3.5"/2.5" Hot-swap SAS3/SATA3 drives (Each node controls 45 drives) 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 2600W Redundant Power Supplies Titanium Level (96%) Drive Controller support via Broadcom® 3916 or 3616 Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN

1. Single Node High density, 2 rear mirrored boot drives, 4 NVMe SSD drives for caching 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 controllers (IT Mode) or Broadcom 3916 (H/W RAID) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2000W Redundant Power Supplies Titanium Level (96%)

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support

Dual socket 3rd Gen Intel® Xeon® Scalable processors, up to 72 Cores 16 ECC DDR4-3200: LRDIMM/RDIMM 3 x PCI-E 4.0 x16 HHHL PCI-E slots 60 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 2280 and 22110) 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 2000W Redundant Power Supplies Titanium Level (96%) Drive Controller support via Broadcom® 3916 or 3616 Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN

Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options

1. High Availability Storage Appliance Platform 2. Redundant Hot-swap expander trays 3. 4 SAS3.0 IO ports 4. 24 Hot-swap 2.5" Drive Bays 5. IPMI 2.0 with dedicated LAN 6. 8x 40mm cooling fans 7. 1200W Redundant Power Supplies Titanium Level Certified

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card support (flexible networking) Note: must bundle with Network card

• High Density Storage • Object Storage 1U • Scale-out Storage • Ceph / Hadoop • Big Data Analytics 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. 2 PCI-E 3.0 x16 slots, 1 PCI-E 3.0 x8 slot 4. 12 Hot-swap 3.5" SAS3/SATA3 drive bays 4 Hot-swap 2.5" 7mm NVMe/SATA drive bays 5. 2x 10GBase-T ports via Intel C622 6. IPMI 2.0 + KVM with Dedicated LAN 7. 1 VGA, 4 USB 3.0 (rear) 8. 600W Redundant Power Supplies Platinum Level Certified