Storage Solutions

1. Single Node High density, 2 rear mirrored boot drives, 4 NVMe SSD drives for caching 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 60 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 controllers (IT Mode) or Broadcom 3916 (H/W RAID) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2000W Redundant Power Supplies Titanium Level (96%)

1. Single Node High density, 2 rear mirrored boot drives, 4 NVMe SSD drives for caching 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 controllers (IT Mode) or Broadcom 3916 (H/W RAID) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2000W Redundant Power Supplies Titanium Level (96%)

1. Dual Node Twin Architecture, 2x compute Each node controls 30 drives 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 60x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 controllers (IT Mode) or Broadcom 3916 (H/W RAID) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%)

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 60x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support

1. Dual Node Twin Architecture, 2x compute Each node controls 45 drives 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 controllers (IT Mode) or Broadcom 3916 (H/W RAID) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%)

Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 2 PCI-E 4.0 x16 (LP) slots, 2 PCI-E 4.0 x8 (LP) slots Intel® Ethernet Controller X550 2x 10GbE RJ45 12x Direct-attached hot-swap 3.5" SAS3/SATA3 drive bays, Onboard 1x NVMe/SATA M.2; 2x Hot-swap 2.5" NVMe Gen 4/SATA (rear, optional) Redundant Titanium 800W Power Supply

Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors 16 ECC DDR4-3200: LRDIMM/RDIMM + 2 Intel® Optane™ Persistent Memory Dedicated Slots 2x 10Gbe 12x 3.5" hot-swap hybrid SATA/SAS drive bays (4 NVMe Hybrid Ports); 2 Rear SATA Slots; onboard 1 M.2 NVMe 3 heavy duty fans with optimal fan speed control; 1 Air Shroud 1600W Redundant Power Supplies Titanium Level (96%) Broadcom® 3816 Controller

Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 1 PCI-E 4.0 x16 (FHHL) slot Intel® Ethernet Controller X550 2x 10GbE RJ45 10x Hot-swap 2.5'' All NVMe tool-less drive bays; Onboard 2x NVMe/SATA M.2 Redundant Platinum 860W Power Supply

Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 2 PCI-E 4.0 x16 (LP) slots, 2 PCI-E 4.0 x8 (LP) slots Intel® Ethernet Controller X550 2x 10GbE RJ45 36x Hot-swap 3.5" SAS3/SATA3 drive bays (24 front + 12 rear), Onboard 1x NVMe/SATA M.2; 2x Hot-swap 2.5" NVMe Gen 4/SATA (rear, optional); 2x Internal fixed bay support up to 4x 2.5" drive bays (optional) Redundant Titanium 1200W Power Supply

Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors 16 ECC DDR4-3200: LRDIMM/RDIMM + 2 Intel® Optane™ Persistent Memory Dedicated Slots 2x 10Gbe 12x 3.5" hot-swap hybrid SATA/SAS drive bays (4 NVMe Hyprid Ports); 2 rear SATA 2.5" slots; onboard 1 M.2 NVMe 3 heavy duty fans with optimal fan speed control; 1 Air Shroud Broadcom® 3916 controller

Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 2 PCI-E 4.0 x16 (LP) slots, 2 PCI-E 4.0 x8 (LP) slots Intel® Ethernet Controller X550 2x 10GbE RJ45 36x Hot-swap 3.5" SAS3/SATA3 drive bays (24 front + 12 rear), Onboard 1x NVMe/SATA M.2; 2x Hot-swap 2.5" NVMe Gen 4/SATA (rear, optional); 2x Internal fixed bay support up to 4x 2.5" drive bays (optional) Redundant Titanium 1200W Power Supply

Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 2 PCI-E 4.0 x16 (LP) slots, 2 PCI-E 4.0 x8 (LP) slots Intel® Ethernet Controller X550 2x 10GbE RJ45 12x Direct-attached hot-swap 3.5" SAS3/SATA3 drive bays, Onboard 1x NVMe/SATA M.2; 2x Hot-swap 2.5" NVMe Gen 4/SATA (rear, optional) Redundant Titanium 800W Power Suppl