Supermicro

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x8 + x8 for SAS3

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card support (flexible networking) Note: must bundle with Network card

Intel® Xeon® Processor D-2141I, 8-Core, 16 Threads, 65W System on Chip Up to 256GB Registered ECC RDIMM or 512GB ECC LRDIMM, DDR4-2133MHz in 4 DIMM slots

Intel® Xeon® Processor D-2183IT, CPU TDP support 100W System on Chip Up to 256GB Registered ECC RDIMM, DDR4-2400MHz; Up to 512GB LRDIMM LRDIMM, in 4 DIMM slots

1. 200 CPUs per 42U Rack 2. Quad socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 3. Intel® C622 chipset 4. 4 Hot-plug 2.5" NVMe/SAS3/SATA3 drive bays and 2 M.2 NVMe/SATA 5. 48 DDR4 LRDIMM/RDIMM slots 6. Dual 10G onboard and/or 100G EDR InfiniBand/ Intel Omni-Path (Mezzanine card) 7. IPMI 2.0, KVM over IP, Virtual Media over LAN 8. Graphics: Aspeed AST2500 BMC

1. 140 CPUs per 42U Rack 2. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 3. Intel® C622 chipset 4. 3 Hot-plug 2.5" NVMe or 3 Hot-plug SATA3 drive bays 5. Intel® C622; RAID 0, 1, 5 6. 24 DDR4 LRDIMM/RDIMM slots 7. Dual 10G onboard 8. IPMI 2.0, KVM over IP, Virtual Media over LAN 9. Graphics: Aspeed AST2500 BMC

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 16 PCI-E 3.0 x16 for RDMA via IB EDR; 2 PCI-E 3.0 x16 on board 4. Supports 16 V100 SXM3 350W GPUs with NVSwitch and NVLink 5. Dual 10GBase-T LAN with Intel® X540 6. 16 Hot-swap 2.5" NVMe drives, 6 Hot-swap 2.5" SATA3 drive bays 7. 6x 80mm Hot-swap PWM Fans, 8x 92mm Hot-swap Fans 8. 6x 3000W Redundant Power Supplies; Titanium Level (96%+)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card support (flexible networking) Note: must bundle with Network card

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8

Intel® Xeon® Processor D-2183IT, 16-Core, 32 Threads, 100W System on Chip Up to 256GB Registered ECC RDIMM or 512GB ECC LRDIMM, DDR4-2400MHz in 4 DIMM slots

8th Generation Intel® Core™ i3/Pentium®/Celeron® Processor, Intel® Xeon® Processor E-2100 series. , Socket LGA 1151 supported, CPU TDP support Up to 95W TDP Intel® C246 chipset