Workstations

1. Quad socket R1 (LGA 2011) supports Intel® Xeon® processor E7-8800 v4/v3, E7-4800 v4/v3 family (up to 24-Core) 2. Up to 2TB DDR3 (64GB LRDIMM), up to 1600MHz; 32x DIMM slots 3. 2x PCI-E 3.0 x16 FH slot; 2x PCI-E 3.0 x8 FH slot 4. Intel® i350 Dual port GbE LAN 5. I/O ports: 2x GbE LAN, 1x Dedicated LAN for IPMI Remote Management, 1x VGA, 1x COM port, 3x USB 2.0 6. 5x 3.5" Hot-swap SATA Drive Bays 7. 3x 9cm + 3x 8cm Heavy Duty fans with speed control 8. 1400W Redundant Digital PS Platinum Level (95%)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 (for SIOM ) 4. 2 Fixed 3.5" SATA3 drive bays M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key 5. Dual GbE ports via SIOM Network card, 1 dedicated IPMI LAN port (front) 6. 1 VGA, 2 USB 3.0 ports (front) 7. 8x 8cm 13.5k RPM rear fans per enclosure 8. 2200W Redundant Power Supplies Titanium Level (96% Efficiency)

1. Single Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ Intel® Xeon® W-32xx processor 2. Intel® Xeon® Scalable Processors: Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots. Intel® Xeon® W-3200 Processors: Up to 2TB 3DS ECC L/RDIMM; up to 1TB 3DS L/RDIMM. (Xeon® W-3200 doesn't support DCPMM.) 3. 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16 slot) M.2 Interface: 4 PCI-E 3.0 x4, RAID 0, 1 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key 4. 1x 10GBase-T and 1x 1GbE LAN ports 5. 8 Hot-swap 3.5" SAS/SATA bay with SGPIO 6. 1 VGA port, VGA connector is dedicated for IPMI 7. 7.1 HD Audio 8. 2200W Redundant Power Supplies Titanium Level Certified

Supports both Intel® Xeon® W-1200 Series and 10th Generation Intel® Core™ Processors 2 PCI-E 3.0 x16 slots (16/NA or 8/8) M.2 Interface: 2 PCI-E 3.0 x4 Dual LAN ports, GbE and 2.5GbE 12cm PWM quiet exhaust fan and optional 12cm front intake fan 668W 80PLUS Platinum Power Supply

1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100 / E-2200 series, 9th/8th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C242 chipset 3. Up to 128GB ECC UDIMM, up to DDR4-2666MHz; 4 DIMM slots 4. 1 PCI-E 3.0 x8 (in x16) slot, 2 PCI-E 3.0 x4 (in x8) slots 5. 4 internal 3.5" drive bays, 2 external 5.25" peripheral bays 6. M.2 Interface: 1 PCI-E 3.0 x4 M.2 Form Factor: 22110/2280 M.2 Key: M-Key 7. 2 USB 3.1 Gen1 (front), 2 USB 3.1 Gen1 (rear), 2 USB 2.0 (rear) 8. 1 COM port, 1 VGA port Power Supply 9. 400W Gold Certified High Efficient Power Supply

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. 13th/12th Generation Intel® Core™ i9/i7/i5/i3/Pentium/Celeron Processor (LGA-1700) 2. Intel® Q670E 3. 2x DDR4-3200MHz SO-DIMM max 64GB 4. Support 1x PCIe 5.0 x16 Slot 5. AMT vPro Supported

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1x PCI-E 3.0 x16, 6x PCI-E 3.0 x8

1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots