Základné dosky (motherboards)

Key Features System on Chip Intel® Xeon® Processor D-1732TE, CPU TDP 52W Up to 256GB Registered ECC RDIMM, DDR4-2667MHz, in 4 DIMM slots 1 PCI-E 4.0 x16 or 2 PCI-E 4.0 x8 1 M.2 M-Key 2280 (SATA/PCI-E 3.0 x4) 1 M.2 B-Key 2280/3042/3052 (USB/SATA/PCI-E 3.0 x2) 1 M.2 E-Key 2230 (PCI-E 3.0 x1) 2 PCI-E 3.0 NVMe x4 SlimSAS Internal Port (4 SATA/PCI-E 3.0 x4) Dual 1G RJ45 with Intel® i210-IT Dual 25G SFP28 with Intel SoC SoC controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 12V DC or ATX Power Input

11th Generation Intel® Core™ i5/i7/i9 Processors, Intel® Xeon® W-1300 Processors Single Socket LGA-1200 (Socket H5) supported, CPU TDP supports Up to 125W TDP Intel® W580 128GB Unbuffered ECC/non-ECC UDIMM, DDR4-3200MHz, in 4 DIMM slots 2 PCI-E 4.0 x16 slots (16/NA or 8/8)2 PCI-E 3.0 x1 1 - 5V PCI 32bit M.2 Interface: 1 PCI-E 4.0 x4 and 2 PCI-E 3.0 x4, RAID 0 & 1 M.2 Form Factor: 2280/22110 M.2 Key: M-Key RAID 5 only applied for INTEL Storage Device

Intel® Xeon® 6700-series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP Up to 1TB ECC RDIMM DDR5-6400MT/s in 8 DIMM slots 6 PCIe 5.0 x8 via MCIO connectors 3 PCIe 5.0 x16, 3 PCIe 5.0 x8, M.2 Interface: 2 PCIe 5.0 x2 M.2 Form Factor: 22110

Intel® Atom® Processor C3858.Single Socket FCBGA-1310 supported, CPU TDP support Up to 25W TDP System on Chip Up to 64GB Unbuffered ECC/non-ECC SO-DIMM, DDR4-2400MHz, in 4 DIMM slots 1 PCI-E 3.0 x41 miniPCI-E with mSATA supports (half card only)M.2 Interface: PCI-E 3.0 x4 and SATAM.2 Form Factor: 2242, 2280M.2 Key: M-Key 1 VGA port SoC controller for 4 SATA3 (6 Gbps) ports; Quad LAN with Intel® C3000 SoC2 10GBaseT, 2 10Gb SFP+Quad LAN with Intel® Ethernet Controller I350-AM41GbE

Intel® Xeon® Processor Skylake-W , Intel® Xeon® Processor W Family., Single Socket R4 (LGA 2066) supported, CPU TDP support Up to 140W Intel® C422 Up to 256GB Registered ECC RDIMM, DDR4-2666MHz; Up to 512GB Registered ECC LRDIMM, in 8 DIMM slots

Intel® Xeon® Scalable Processors, Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Intel® C621 Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz, in 16 DIMM slots 3 PCI-E 3.0 x16 (in x16 slot)

8th Generation Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium®, Intel® Xeon® E processor (Coffee Lake-S) Server, Intel® Xeon® E processor (Coffee Lake-S) Workstation., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 95W TDP Intel® C246 Up to 64GB Unbuffered ECC/non-ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x16 slot), 1 PCI-E 3.0 x4, 1 PCI-E 3.0 x1, 2 PCI-Ex16 slots are running at NA/16, or 8/8 1 PCI, 1 - 5V PCI 32bit M.2 Interface: 2 PCI-E 2.0 x4, RAID 0 & 1 M.2 Form Factor: 22110 M.2 Key: M-Key M.2#1~2 are shared with SATA #6~7, M.2#2 is shared with U.2 U.2 Interface: 1 PCI-E 3.0 x4 1 HDMI port, 1 DVI - I port, 1 DP (DisplayPort) port, HDMI is HDMI2.0a, DP is DP1.2, Intel® C246 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Single LAN with Intel® Ethernet Controller I210-AT Single LAN with Intel® PHY I219LM LAN controller Support vPro

Single socket H4 (LGA 1151) supports Intel® Xeon® processor E3-1200 v6/v5, Intel® 7th/6th Gen. Core™ i3 series, Intel® Celeron® and Intel® Pentium® Intel® C236 chipset Up to 64GB Unbuffered ECC UDIMM DDR4 2400MHz; 4 DIMM slots Expansion slots: 1 PCI-E 3.0 x4 (in x16, Right Riser slot), 1 PCI-E 3.0 x16 (Left Riser slot) Dual GbE LAN with Intel® i210-AT 6 SATA3 (6Gbps) via C236; RAID 0, 1, 5, 10 I/O: 1 VGA, 2 COM, TPM header 2 SuperDOM with built-in power 5 USB 3.0 (2 rear, 2 via header(s), 1 Type A), 6 USB 2.0 (2 rear, 4 via header(s)) M.2 NGFF connector M.2 Interface: PCI-E 3.0 x4 and SATA Form Factor: 2260, 2280, 22110 Key: M-Key Double Height Connector

3rd Gen Intel® Xeon® Scalable processors, Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s Intel® C621A Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, NMI, SPM, SSM, SUM, SuperDoctor® 5, Watchdog Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 6TB Intel® Optane™ Persistent Memory 200 Series, in 16 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode. 6 PCIe 4.0 x16, 1 PCIe 4.0 x8 M.2 Interface: 2 PCIe 4.0 x4, RAID 0 & 1 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key Dual LAN with Broadcom BCM57416 10GBase-T Integrated IPMI 2.0 and KVM with Dedicated LAN 5 USB 3.0 ports, 4 USB 2.0 ports HD Audio with optical S/PDIF

1. Intel® Atom® Processor x7433RE (9W, 4C) 2. DDR5 4800 MHz, SODIMM x 1, Up to16GB, In-Band ECC supported 3. M.2 M-Key 2242/2280, M.2 E-key 2230, M.2 B-key 2240/3052/2280 4. Dual 2.5GbE, M.2 B-key w/ nano SIM & 5G module supported 5. 9-36V wide range power with RVP and TVS

System on Chip Intel Atom Processor P5322, Single Socket FCBGA-2106 supported, CPU TDP support 55 W Intel Quick Assist Technology Up to 256GB ECC RDIMM DDR4-2400MHz, in 2 DIMM slots 2x 25G SFP28 ports and 8 GbE RJ45 LAN ports Supports 12V DC power input

Intel Pentium Processor N3700, Single socket FCBGA 1170, 6W System-on-Chip Up to 8GB 1600MHz DDR3 Non-ECC SO-DIMM in 2 sockets 1x PCI-E 2.0 x1 (in x8), 1x Mini-PCIe (mSATA support) Quad GbE LAN with Intel® i210-AT