Základné dosky (motherboards)

3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP Intel® C621A Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 2TB Intel® Optane™ Persistent Memory 200 Series, in 8 DIMM slots 1 PCI-E 4.0 x8, 2 PCI-E 4.0 x16, 4 PCI-E 4.0 NVMe x4 Internal Port(s) M.2 Interface: 1 SATA/PCI-E 3.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key Dual LAN with 10GBase-T with Intel® X550 Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Supports 12V DC power input 4x NVMe port PCI-E 4.0 x4 via SlimSAS connector 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 4. 3 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, and 1 PCI-E 2.0 x4 (in x8) slot

Intel® 8th/9th Generation Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® series Processor., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 120W TDP Intel® Z390 Express Up to 64GB Unbuffered non-ECC UDIMM, DDR4-4000MHz (O.C), in 2 DIMM slots *Coffee Lake refresh core i5/i7 processors support 32GB memory 1 PCI-E 3.0 x16 M.2 Interface: 2 PCI-E 3.0 x4, RAID 0 & 1 and 1 CNVi M.2 Form Factor: 2260/2280, 2230 M.2 Key: M-Key, E-Key (RAID 0,1 support) One M.2 (M-Key) on Top side and One M.2 (M-key)on back side 1 HDMI port, 1 DP (DisplayPort) port, HDMI up to 2.0a, DP up to 1.2 Single LAN with Intel® single Ethernet PHY i219V Single LAN with Intel® single Ethernet PHY i219V

Intel® Xeon® processor D-1567, Single socket FCBGA 1667; 12-Core, 24 Threads, 65W Up to 128GB ECC RDIMM DDR4 2133MHz or 64GB ECC/non-ECC UDIMM in 4 sockets 2 PCI-E 3.0 x8, Mini PCI-E (mSATA support), M.2 PCI-E 3.0 x4 (SATA support)

Intel® Xeon® Scalable Processors. Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP Intel® C621 Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz;

1. Intel® Atom processor C2358, SoC, (Rangeley), 7W 2-Core, 1.7-2.0GHz 2. Up to 16GB DDR3 1333MHz ECC or non-ECC UDIMM 3. 7x GbE LAN including 6 ports LAN bypass (SW programmable) ports with SoC I354, I350-AM2 and I210-AT 4. IPMI 2.0 with shared LAN

System on Chip, Intel Atom Processor C5315, Single Socket FCBGA-2106 supported, CPU TDP support 38W, Intel Quick Assist Technology, Up to 128GB ECC RDIMM DDR4-2400MHz in 2 DIMM slots

First performance hybrid architecture from Intel 4 independent display with 4K resolution Fast AI hardware acceleration Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2 High speed connectivity through dual 2.5GbE 100% wide temp grade design and components applied 12-24V wide range power with RVP and TVS Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2 Hailo-8™ powerful and efficient Edge AI solution integration ready

11th Generation Intel® Core™ i5/i7/i9 Processors Single Socket LGA-1200 (Socket H5) supported, CPU TDP supports Up to 125W TDP Intel® Z590 2 PCI-E 4.0 x16 slots (16/NA or 8/8)2 PCI-E 3.0 x1, (Slot#4 and Slot#6 can be configured as 16/NA, 8/8) M.2 Interface: 2 PCI-E 3.0 x4 and 1 PCI-E 4.0 x4 M.2 Form Factor: 2260/2280/22110 M.2 Key: M-Key The CPU-attached M.2 slot is support with the Intel NVMe drives only (support RAID 0,1). _x005F_x000D_ PCH-attached M.2 slots can support either Intel optane memory with solid state or 3rd party NVMe SSD (support RAID 0,1); M.2-E1 port pre-installed one Intel Wi-Fi 6(802.11ax)+BT5.1 module

1. Intel® Xeon® processor D-1557, Single socket FCBGA 1667; 12-Core, 24 Threads, 45W 2. System on Chip 3. Up to 128GB ECC RDIMM DDR4 2133MHz or 64GB ECC/non-ECC UDIMM in 4 sockets 4. 1 PCI-E 3.0 x16, M.2 PCI-E 3.0 x4 (SATA support), M Key 2242/2280 5. 2 10GbE and 2 GbE LAN ports