Komponenty

Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s Intel® C627 Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots

10th Generation Intel® Core™ i9/Core™ i7/Core™ i5/Core™ i3 Processor, Intel® Xeon® W-1200 Processors Single Socket LGA-1200 (Socket H5) supported, CPU TDP supports Up to 65W TDP Intel® W480E Up to 64GB DDR4 ECC/non-ECC SO-DIMM, DDR4-2933MHz, in 2 DIMM slots 1 PCI-E 3.0 x16 slots (16/NA or 8/8) 1 M.2 M-Key PCI-E 3.0 x4, 2280 1 HDMI port, 1 DP (DisplayPort) port Intel® W480E controller for 4 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Single LAN with Intel® Ethernet i225LM Single LAN with Intel® Ethernet i225V

1U chassis, supports maximum motherboard sizes - ATX 12" x 10" and Micro-ATX 9.6" x 9.6" 4 x 3.5" hot-swap SAS/SATA SAS or enterprise SATA HDD only recommended 4-port 1U TQ backplane (W/ enclosure management)

1. MicroLP Form Factor for Supermicro Micro Cloud systems 2. Broadcom BCM57416 dual-port 10Gbps controller 3. PCI-E 3.0 x4 (8GT/s) interface 4. Dual RJ45 connectors

1. Intel® Atom processor C2758, SoC, FCBGA 1283, 20W 8-Core 2. Up to 64GB DDR3 1600MHz ECC SO-DIMM in 4 DIMM sockets 3. Quad GbE LAN ports 4. IPMI with dedicated LAN 5. 2x SATA3 and 4x SATA2 ports 6. 1x PCI-E 2.0 x8 slot

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 4. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x4 (in x8), 1x PCI-E 2.0 x4 (in x8) slot 5. Dual GbE LAN ports via Intel® i210