Komponenty

1. MicroLP Form Factor for Supermicro Micro Cloud systems 2. Broadcom BCM57416 dual-port 10Gbps controller 3. PCI-E 3.0 x4 (8GT/s) interface 4. Dual RJ45 connectors

Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 205W Intel® C621 Chipset Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots

Intel® Xeon® E-2300 Processor, 10th Generation Intel® Pentium® Processor, Single Socket LGA-1200 (Socket H5) supported, CPU supports Up to 95W TDP Intel® C252 Up to 64GB Unbuffered ECC UDIMM, DDR4-3200MHz, in 2 DIMM slots 1 PCI-E 4.0 x16 M.2 Interface: 1 PCI-E 3.0 x4 M.2 Form Factor: 2280 M.2 Key: M-Key Dual LAN with Intel® i210 Gigabit Ethernet Controller Intel® C252 controller for 6 SATA3 (6 Gbps) ports; RAID 0,1,5,10 1 VGA D-Sub Connector port 2 SuperDOM with built-in power 4x USB 3.2 Gen1 (2 rear, 2 via header), 4x USB 2.0 (2 rear, 2 via headers)

Key Features System on Chip Intel® Xeon® Processor D-1747NTE, CPU TDP 80W, Intel Quick Assist Technology Up to 256GB Registered ECC RDIMM, DDR4-2933MHz, in 4 DIMM slots 1 PCI-E 4.0 x16 or 2 PCI-E 4.0 x8 1 M.2 M-Key 2280 (SATA/PCI-E 3.0 x4) 1 M.2 B-Key 2280/3042/3052 (USB/SATA/PCI-E 3.0 x2) 1 M.2 E-Key 2230 (PCI-E 3.0 x1) 2 PCI-E 3.0 NVMe x4 SlimSAS Internal Port (4 SATA/PCI-E 3.0 x4) Quad 1G RJ45 with Intel® I350-AM2 and i210-IT Dual 25G SFP28 with Intel SoC SoC controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 12V DC or ATX Power Input

1. Intel Atom Processor C3858, Single Socket FCBGA1310 supported, CPU TDP support 25W 2. Intel Quick Assist Technology 3. Expansion slots: 1 PCI-E 3.0 x4, M.2 Interface: PCI-E 3.0 x2 and SATA, M.2 Form Factor: 2242, 2280, M.2 Key: M-Key 4. 4 GbE LAN ports 5. 12 SATA3 (6 Gbps) ports