Komponenty

1U chassis supports for maximum motherboard sizes - ATX 12" x 10" and Micro-ATX 9.6" x 9.6" 4 x 3.5" hot-swap SAS/SATA SAS or enterprise SATA HDD only recommended 4-port 1U TQ backplane (W/ enclosure management), support up to 4x 3.5-inch SAS/SATA HDD 1U 600/680W Multi-output 80PLUS gold power supply, 24pin output 1 full-height & half-length expansion slot(s) (Riser Card Required) 4 x 4cm high performance PWM fan(s) Optional 1 x fan for PCI card cooling

2U chassis supports for maximum motherboard sizes - 13.68" x 13.4", E-ATX 12" x 13", ATX 12" x 10" motherboards 16 x 3.5" hot-swap SAS/SATA drive bay with SGPIO, optional 2 x 2.5" hot-swap SAS/SATA drive bay 12-port 2U SAS3 12Gbps single-expander backplane, support up to 8x 3.5-inch SAS3/SATA3 HDD/SSD and 4x NVMe/SAS3/SATA3 storage devices 4-port internal SAS3 12Gbps backplane, support up to 4x 3.5-inch SAS3/SATA3 HDD/SSD 1U 800/1000W Redundant Single Output Power Supply Titanium Level, CRPS 203mm length 7 low-profile expansion slot(s) 4 x 80x38mm hot-swap cooling fan(s)

Intel® Xeon® processor D-1557, Single socket FCBGA 1667; 12-Core, 24 Threads, 45W System on Chip Up to 128GB ECC RDIMM DDR4 2133MHz or 64GB ECC/non-ECC UDIMM in 4 sockets 1 PCI-E 3.0 x16, M.2 PCI-E 3.0 x4 (SATA support), M Key 2242/2280 2 10GbE and 2 GbE LAN ports 6 SATA3 (6Gbps) ports via SoC 2 USB 3.0 ports (rear) 4 USB 2.0 ports (via headers) 1 SuperDOM, 1 COM, TPM header, GPIO and SMbus headers 12V DC Input and ATX Power Source

AIOM 4port GbE SFP,Intel i350-AM4 with 0.5U bracket,RoHS

2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Single Socket P (LGA 3647) supported, CPU TDP support 205W Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots Intel® C622 chipset

1. High-density 3U JBOD chassis solution: Total 28x (16 front + 12 rear) 3.5" Hot-swap HDD bays; 6Gb/s SAS2 Expander Backplane 2. Single expander chip for cost-effective solution