Komponenty

3rd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s Intel® C621A Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 6TB Intel® Optane™ Persistent Memory 200 Series, in 16 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode. 6 PCI-E 4.0 x16, 1 PCI-E 4.0 x8 (in x4 slot) M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2280/22110, 2280/22110 M.2 Key: M-Key Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, NMI, SPM, SSM, SUM, SuperDoctor® 5, Watchdog Dual LAN with Intel® X550 10GBase-T Ethernet Controller Integrated IPMI 2.0 and KVM with Dedicated LAN 5 USB 3.0 ports, 4 USB 2.0 ports HD Audio with optical S/PDIF

Form Factor: 1U Ultra Riser Controller Type: GbE Chipset: Intel® i350 Ports: 4 Connector: RJ45 PCI-E Slot: 1x PCI-E 3.0 x8 (internal) NVMe Ports: 0

Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 205W Intel® C622 chipset Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots

2U chassis support max. motherboard size - ATX 12" x 10", E-ATX 12" x 13", EE-ATX 13" x 13.68". Support up to ATX 12"x13" MB with rear 2.5" HDD option installed 12x 3.5" (tool-less) or 2.5" (screw) hot-swap SAS3/SATA drive bay with SES3 Optional rear 2x 2.5" hot-swap drive bay kit 12-port 2U SAS3 12Gbps single-expander backplane, support up to 8x 3.5-inch SAS3/SATA3 HDD/SSD and 4x NVMe/SAS3/SATA3 storage devices

Patice: AMD Socket G34 Pre CPU: AMD OpteronTM Processor 6000 Series Rozmery: 112x72x26.5 Ventilátor: pasívny Formát: H8 Socket G34 1U UP, DP, MP TDP: 115 W

Veľkosť: 92 x 92 x 38 mm Rýchlosť: 5 000 RPM Hlučnosť: 50 dBA Prietok vzduchu: 109.7 CFM Konektor: 4 Pin

Optimized for X11 WIO (W series) motherboards, support MB size up to 12.3" x 13.4" 4 x 3.5" hot-swap SAS/SATA SAS or enterprise SATA HDD only recommended 1U 4-Port 12Gbps Backplane Support 4x3.5

Intel® Xeon® W-3400 series and Xeon® W-2400 series processors, TDP up to 350W Intel® W790 Up to 2TB RDIMM 3DS, 512GB ECC RDIMM; DDR5-4800MT/s (1DPC)/4400MT/s (2DPC), in 8 DIMM slots 3 PCIe 5.0 x16 Slots, support up to 3 Single Width/2 Double Width/2 Triple Width GPU cards 1 PCIe 4.0 x4 Slots M.2 Interface: 2 PCIe 5.0 x4 M.2 Form Factor: 2280/22110 M.2 Key: M-Socket (w/o heat sink) 1GbE LAN port with Intel® Ethernet Controller I210-AT 10GbE LAN with Marvell AQC113 6 SATA 3 (6Gb, RAID 0, 1, 5, 10) IPMI Supported Overclocking Supported (optional)

Výkon: 350 W Formát: 1U Certifikácia: Platinum Efektivita: 94%

Single socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 and E5-1600 v4†/ v3 family Intel® C612 chipset Up to 512GB† ECC 3DS LRDIMM, up to DDR4- 2400†MHz; 4x DIMM slots 2 GbE LAN ports via Micro LP card 1 Dedicated LAN for IPMI Remote Management 2 SATA 3.0 (6Gbps) ports

Based on Broadcom 3616 Sixteen Port SAS-3 controller with external connectors. IT mode, SAS transfer rates up to 12Gb/s and SATA rates up to 6Gb/s Connects up to 1024 SAS/SATA devices Supports critical applications with the bandwidth of PCI-E 3.1 connectivity Supports SSP, SMP, STP and SATA protocols OS Support: Windows Server 2016, 2012, 2008 64/32 bit; Red Hat Enterprise and SUSE Linux

1. Intel® Quark™ SoC X1021; 2.2W only 2. 512MB DDR3 ECC memory onboard 3. 2x Mini-PCI-E slots; 1x ZigBee module socket 4. TPM 1.2 onboard, 2x 10/100Mbps LAN 5. Operating Temperature: -20°C - 75°C