Komponenty

Intel® 8th/9th Generation Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® series Processor., Single Socket LGA 1151 supported, CPU TDP support Up to 140W Intel® Z390 Express Up to 128GB Unbuffered non-ECC UDIMM, DDR4-4000MHz (O.C), in 4 DIMM slots *Coffee Lake refresh core i5/i7 processors support 32GB memory 4 PCI-E 3.0 x16 slots (16/NA/16/NA or 16/NA/8/8 or 8/8/16/NA or 8/8/8/8), 1 PCI-E 3.0 x1 M.2 Interface: 2 PCI-E 3.0 x4, RAID 0 & 1 and 1 CNVi M.2 Form Factor: 2260/2280/22110, 2260/2280, 2230 M.2 Key: M-Key, M-Key, E-Key (RAID 0,1 support) M.2-M1 port shares PCI-E link with U2-1 port;M.2-M2 port shares link with SATA port4 and port5; M.2-E1 port pre-installed one 802.1ac WiFi+BT5.0 module U.2 Interface: 2 PCI-E 3.0 x4 and PCI-E 3.0 x4 2 DP (DisplayPort) ports, 1 HDMI port, Display port up to 1.2, HDMI up to 2.0a Intel® Z390 Express controller for 6 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Single LAN with Intel® single Ethernet PHY i219V Single LAN with Aquantia® AQC107 10G Ethernet Controller

4U chassis support for max. motherboard size - 13.68" x 13" E-ATX, 12" x 10" ATX and 9.6" x 9.6" Micro-ATX 24 x 3.5" hot-swap drive bay, optional 2 x 3.5" fixed drive bay Optional 1x Fixed Internal Hard Drive Bay and 1x DVD-ROM Drive or Floppy Drive Bay

Výkon: 400 W Formát: 2U

[NR]2x SATA M.2 RAID Carrier, Standard LP,RoHS

Patice: 771 Pre CPU: Intel® Xeon® 5000 Series Rozmery: 89x79x52 Chlazenie: Pasivní Formát: 2U

2nd Gen Intel® Xeon® Scalable Intel® C621 Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots 2 PCI-E 3.0 x16,3 PCI-E 3.0 x8,1 PCI-E 3.0 x4 (in x8 slot)M.2 Interface: 1 SATA/PCI-E 3.0 x4M.2 Form Factor: 2260, 2280M.2 Key: M-Key 1 VGA port Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Dual LAN with 1GbE with Intel® X722 + Marvell 88E1512

1. Intel X710-AT2 dual-port 10Gbps controller 2. Dual RJ45 Connectors 3. Grand Twin I/O card

1. 980W Redundant High-efficiency Platinum Level (94%+) Power Supplies 2. 8x 3.5" Hot-swap SAS / SATA & 2x 5.25" Drive Bays 3. Support Optional Slim DVD, Hot-swap Slim HDD/SSD drive, Rear 2.5" x2 Drive Kits and Mobile Racks 4. 11x Expansion slots (7 FHFL, 4 FHHL) 5. Five Fans (4 middle, 1 rear) for 100% Cooling Redundancy & Adjustable Air Shroud 6. Note: Full SES2 Support is only available on SAS motherboards

1U Passive CPU Heatsink for Intel Xeon

1. Intel® processor N97 (12W, 4C) 2. DDR5 4800 MHz, SODIMM x 1, Up to16GB, In-Band ECC supported 3. Dual 2.5GbE, M.2 B-key w/ nano SIM & 5G module supported 4. 9-36V wide range power with RVP and TVS

Single AMD EPYC™ 7002 Series Processor 4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs Expansion slots: 1 PCI-E 4.0 x32 Left Riser Slot 1 PCI-E 4.0 x16 Right Riser Slot M.2 Interface: 2 PCI-E 4.0 x2 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 12 native NVMe via SlimSAS, 4 NVMe or 16 SATA3 ports via SlimSAS, 2 M.2, 2 SATA3 Dual GbE LAN Ports via Broadcom BCM5720 ASPEED AST2500 BMC graphics Up to 7 USB 3.0 ports 6x 4-pin PWM Fans & Speed control

1. Mini 1U Chassis, Optimized for Intel Atom Platforms 2. 200W Low Noise Power Supply 3. 1x 3.5" Internal Drive Bay 4. OR 2x 2.5" Internal Drive Bay (Optional) 5. OR 1x Full-height, Half-length PCI Expansion Slot (Optional)