Komponenty

3rd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s Intel® C621A Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 6TB Intel® Optane™ Persistent Memory 200 Series, in 16 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode. 6 PCI-E 4.0 x16, 1 PCI-E 4.0 x8 (in x4 slot) M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2280/22110, 2280/22110 M.2 Key: M-Key Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, NMI, SPM, SSM, SUM, SuperDoctor® 5, Watchdog Dual LAN with Intel® X550 10GBase-T Ethernet Controller Integrated IPMI 2.0 and KVM with Dedicated LAN 5 USB 3.0 ports, 4 USB 2.0 ports HD Audio with optical S/PDIF

3U Storage JBOD Chassis with capacity 16 x 3.5" hot-swappable HDDs bays Single Expander Backplane Boards support SAS3/2 HDDs with 12Gb/s throughput 4 x Mini-SAS HD ports for Internal / External Cascading Expander Combination for high performance, high availability or high redundancy requirements

• Dual SFP+ Connectors • Super I/O Module (SIOM) Form Factor • Intel® QuickData Technology • VMDq, Next-Generation VMDq, and PC-SIG SR-IOV for Virtualized Environments • Load Balancing on Multiple CPUs • iSCSI Remote Boot Support • Fibre Channel over Ethernet (FCoE) Support • Support for most Network Operating Systems • NC-SI for Remote Management • RoHS compliant 6/6 • Supports both Direct Atttach Copper and Fiber Cables

1. Intel® Xeon® processor D-1587, Single socket FCBGA 1667; 16-Core, 32 Threads, 65W 2. System on Chip 3. Up to 128GB ECC RDIMM DDR4 2133MHz or 64GB ECC/non-ECC UDIMM in 4 sockets 4. 1 PCI-E 3.0 x16

Sanyo Denki Axial Fan - 80 x 80 x 25mm Compatible with CSE-743TS and CSE-745BTS Series Chassis Fan Speed: 2,800 RPM Supermicro Certified

1U Prop. Passive HS for Intel B13 Blade Series

Advanced I/O Module (AIOM) Form Factor Intel® i350 GbE controller 4 SFP Connectors Energy Efficient Ethernet (EEE) Reliable and proven Gigabit Ethernet technology Asset Management Features with NC-SI for Remote Management

1U Passive CPU HS for X13 Intel Eagle Stream Platform

1U I/O Shield for X11SCZ on SC510 with EMI Gasket,RoHS

3rd Gen Intel® Xeon® Scalable Processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP Intel® C621A Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 2TB Intel® Optane™ Persistent Memory 200 Series, in 8 DIMM slots 2 PCI-E 4.0 x16 1 PCI-E 4.0 NVMe x8 SlimSAS Internal Port 1 PCI-E 4.0 NVMe x4 SlimSAS Internal Port 1 OCuLink Connector (4 SATA/PCI-E 3.0 x4) 1 M.2 M-Key 2242/2280 (SATA/PCI-E 3.0 x4) Quad 1G RJ45 with Intel® I350-AM4 Dual 25G SFP28 with Broadcom BCM57414 4 USB 3.2 Gen 1 (2 Rear, 2 via Header), 4 USB 2.0 (Headers) Supports 12V DC power input

2U chassis supports for maximum motherboard sizes - SMC Proprietary WIO , 13.68" x 13" motherboards 8 x 3.5" hot-swap SAS/SATA drive bay with SGPIO, 2 x 3.5" fixed drive bay 8-port 2U SAS3 12Gbps TQ backplane, support up to 8x 3.5-inch SAS3/SATA3 HDD/SSD 4 full-height & full-length expansion slot(s) , 3 low-profile expansion slot(s) 3 x 8cm (7000 RPM) hot-swap PWM cooling fan(s)

Výkon: 350 W Formát: 1U Certifikácia: Platinum Efektivita: 94%