Komponenty

2U 8x 3.5" hot-swap bays, tool-less 3.5" and 2.5" HDD tray, 800W CRPS Titanium redundant power supply, top plate HDDx2 + CD-ROM plate, 2x 7mm 2.5" hot-swap OS, rail, 2x 4-port 12Gb SATA/SAS backplane

Patice: 939/940 Pre CPU: AMD Opteron™ Rozmery: 98x74x26 Chlazenie: Pasivní Formát: 1U

CPU Mounting Bracket for LGA 1356/1366 Socket

1. 700W/750W redundant Platinum Level (PWS-706) or Gold level (PWS-704) high-efficiency power supplies 2. 10x 2.5" Hot-swap SAS2/ SATA3 Drive Bays 3. 4x 4cm Counter-rotating PWM fans 4. 2x Full-height I/O Expansion slots &1x Low-profile I/O Expansion slot 5. Supports maximum motherboard size 12" x 13" 6. Optimized for WIO motherboards 7. 2x Front USB 3.0

Single AMD EPYC™ 7003/7002 Series Processor (7003 Series Processor drop-in support requires BIOS version 2.0 or newer) 4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs Expansion slots: 1 PCI-E 4.0 x32 Left Riser Slot 1 PCI-E 4.0 x16 Right Riser Slot M.2 Interface: 2 PCI-E 4.0 x2 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 12 native NVMe via SlimSAS, 4 NVMe or 16 SATA3 ports via SlimSAS, 2 M.2, 2 SATA3 2x 10GBase-T LAN Ports via Broadcom BCM57416 ASPEED AST2500 BMC graphics Up to 7 USB 3.0 ports 6x 4-pin PWM Fans & Speed control

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 4. 2x PCI-E 3.0 x16, 3x PCI-E 3.0 x8, and 1x PCI-E 2.0 x4 (in x8) slot

Key Features System on Chip Intel Atom Processor P5362, Single Socket FCBGA-2106 supported, CPU TDP support 83 W Intel Quick Assist Technology Up to 256GB ECC RDIMM DDR4-2933MHz, in 2 DIMM slots 2x 25G SFP28 ports and 8 GbE RJ45 LAN ports Supports 12V DC power input I/O: 1 VGA, 1 COM, TPM 2.0 onboard and header both 2 USB 3.0 (Type-A on rear) 2 USB 2.0 (via headers) Expansion slots: 1 PCI-E 3.0 x8 1 PCI-E 2.0 x4 Up to 5 SATA 2.0 ports M.2 Interface: 1x M.2 B-Key 3042/2280 w/PCIe 3.0 or SATA3 1x M.2 M-Key 2280 w/PCIe3.0

Intel® Xeon® Scalable Processors, Intel® Xeon® W-32xx Processor. Single Socket LGA-3647 (Socket P) supported, CPU TDP support 205W TDP Intel® C621 Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz

Intel® Xeon® E-2300 Processor, 10th Generation Intel® Pentium® Processor, Single Socket LGA-1200 (Socket H5) supported, CPU TDP supports Up to 95W TDP Intel® C256 Up to 128GB Unbuffered ECC UDIMM, DDR4-3200MHz 1 PCI-E 4.0 x16 Left Riser Slot 1 PCI-E 3.0 x4 (in x8, Right Riser slot) M.2 Interface: 1 PCI-E 4.0 x4 and 1 PCI-E 3.0 x4 M.2 Form Factor: 2280/22110 M.2 Key: M-Key Double Height Connector Dual LAN with Intel® i210 Gigabit Ethernet Controller Intel® C256 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10 1 VGA port 4 USB 3.2 Gen1 ports (2 rear + 2 via headers) 1 USB 3.2 Gen2 port (1 Type A) 6 USB 2.0 ports (2 rear + 4 via headers)

Výkon: 560 W Formát: 1U

1. Intel® Q170 Express chipset 2. Up to 32GB Unbuffered Non-ECC SO-DIMM DDR4 2400MHz; 2 DIMM slots 3. 1 PCI-E 3.0 x16, Mini-PCI-E (mSATA support) M.2 PCI-E 3.0 x4 (SATA support), M Key 2242/80

1. Extreme High Density and High Capacity Storage Chassis support 60 x 3.5" Top Loading SAS/SATA 12Gb/s Hot Swapping HDD/SSD Bays 2. Tool-less HDD tray with HDD LED indicator 3. Dual Expander Backplane Boards support SAS3/2 HDDs with 12Gb/s throughput 4. 8 x Mini-SAS HD ports for Internal / External Cascading Expander Combination for high performance, high availability or high redundancy requirements 4. 1x IPMI port for Remote System Power on/off and system monitoring 5. Support NTP for time synchronization & RTC battery backup 6. 1600W (1+1) Redundant High-efficiency Platinum Level Power Supplies 7. Optimized cooling w/ 5x 80x38mm rear hot-swap fans 8. Support front LCD panel for system status & error info (Option) 9. Ideal for Cloud backup, data Replication or High density Archive Storage Applications