Rackmounts

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 3 PCI-E 3.0 x8 slots (2 FH 10.5" L, 1 LP) 4. 2x 10GBase-T ports

Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 1 PCI-E 3.0 x16 slot (FH, 10.5" L), 7 PCI-E 3.0 x8 slots (5 FH, 10.5" L, 1 LP, 1 Internal LP) 4 Gigabit Ethernet ports 12 Hot-swap 3.5" Drive Bays: 4x heavy duty fans w/ optimal fan speed control 1000W High efficiency (96%)

Single-Socket, 4th Gen Intel® Xeon® Scalable processors up to 300W TDP Intel® C741 16 DIMM Slots up to 4TB (with Intel® Optane™ Persistent Memory support) 2 AIOM Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE 6x NVMe/SAS/SATA drive bays 2x cooling fans per 2U enclosure, 16.5K RPM Heavy Duty; Shared Cooling Design 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design Built-in SAS3 Support via Broadcom 3808; IT Mode

Single 4th Generation AMD EPYC™ 9004 Series Processors 12 DIMM slots up to 3TB 3DS ECC RDIMM DDR5-4800MHz 4 PCI-E 5.0 x16 FHHL (OR) 2 PCI-E 5.0 x16 FHHL and 4 PCI-E 5.0 x8 FHHL 2 PCI-E 5.0 x16 AIOM (OCP 3.0) Dual AIOM with NCSI (OCP 3.0) for networking, 1 dedicated IPMI LAN 12x 3.5/2.5" hot-swap hybrid NVMe/SATA/SAS drive bays 2 On-board PCI-E 3.0 x4 M.2 NVMe 80mm/110mm (Boot) 3 heavy duty fans with optimal fan speed control, 1 air shroud 1200W redundant Titanium level 100-240Vac and 200-240 Vdc power supplies (*Full redundancy based on configuration and application load) 1 VGA, 1 COM, 2 USB 3.0 (rear)