Workstations

1. Single Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ Intel® Xeon® W-32xx processor 2. Intel® Xeon® Scalable Processors: Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots. Intel® Xeon® W-3200 Processors: Up to 2TB 3DS ECC L/RDIMM; up to 1TB 3DS L/RDIMM. (Xeon® W-3200 doesn't support DCPMM.) 3. 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16 slot) M.2 Interface: 4 PCI-E 3.0 x4, RAID 0, 1 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key 4. 1x 10GBase-T and 1x 1GbE LAN ports 5. 8 Hot-swap 3.5" SAS/SATA bay with SGPIO 6. 1 VGA port, VGA connector is dedicated for IPMI 7. 7.1 HD Audio 8. 2200W Redundant Power Supplies Titanium Level Certified

1. Single socket P (LGA 3647) supports Intel® Xeon® Phi™ x200 processor, CPU TDP support Up to 260W 2. Intel® C612 chipset 3. Up to 384GB ECC LRDIMM, 192GB ECC RDIMM, DDR4-2400MHz in 6 DIMM slots 4. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x4 5. 6x 3.5" and 4x 2.5" tool-less drive bays, 2x 5.25" peripheral bays

1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 4. 2x 10GBase-T with Intel® X557 5. 36 Hot-swap 3.5" SAS/SATA drive bays with SES3 (24 front + 12 rear); 4 Internal fixed 2.5" drive bays 2 Hot-swap 2.5" NVMe/SATA (rear, optional) 6. SAS3 via Broadcom 3008 controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 7 High-performance 8cm PWM fans 9. 1200W Redundant Power Supplies Titanium Level (96%)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 11 PCI-E 3.0 x16 (FH, FL) slots 1 PCI-E 3.0 x8 (FH, FL in x16 slot) 4. Up to 24 Hot-swap 2.5" drive bays; 10x 2.5" drives supported natively, 1 NVMe based M.2 SSD 5. 2x 10GBase-T LAN ports via Intel C622 6. 8 Hot-swap 92mm RPM cooling fans 7. 2000W (2+2) Redundant Power Supplies Titanium Level (96%+)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8

Intel® Core™ Ultra 9/7/5 Processors up to 125W with air cooling or optional liquid cooling Supports for up to 1 double-width or triple-width GPU Supporting up to 192GB DDR5-5600 1 HDMI 2.1*, 1 DP 2.1**, 1 Thunderbolt™ 4.0 Type-C® *Supports data rates of up to 10 Gbps 2 PCIe NVMe M.2 and 2 PCIe 4.0 NVMe U.2 2 PCIe 5.0 x16 FHFL + 1 PCIe 4.0 x4 slots

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots 4. 2x 1GbE LAN ports 5. 7.1 HD Audio 6. 4 Internal fixed 3.5" drive bays, 2 5.25" peripheral drive bays 7. 1 M.2 slot, 2 NVMe support with optional cables 8. 1200W High-efficiency Power Supply Platinum Level Certified

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8

1. Dual socket R (LGA 2011) supports Intel® Xeon® processor E5-2600 and E5-2600 v2 family† 2. Up to 1TB ECC DDR3, up to 1866MHz; 16x DIMM slots 3. Expansion slots: 3 (x16) PCI-E 3.0, 2 (x8) PCI-E 3.0 & 1 (x4) PCI-E 3.0 4. Intel® i350 Dual port Gigabit Ethernet 5. 2x SATA3 and 8x SATA2 ports 6. 8x 3.5" Hot-swap SATA HDD Bays 7. 1200W High Efficiency Power Supply Platinum Level (94%)

1. Single Socket R4 (LGA 2066) supports Intel® Xeon® W-2200 processor, Intel® Xeon® W-2100 processor 2. Intel® C422 chipset 3. Up to 512GB reg. ECC LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 4. 3 PCI-E 3.0 x16 (8/16/16, 48 lanes), 1 PCI-E 3.0 x4, M.2 Interface: 2 PCI-E 3.0 x4 M.2 Form Factor: 22110/2280 M.2 Key: M-Key (RAID 0,1 support) U.2 Interface: 2 PCI-E 3.0 x4 5. ALC 1220 7.1 HD Audio, 1 COM, 5GbE and GbE LAN, 2 USB 3.0 (front) 6. 4 internal 3.5" drive bays 7. 900W High Efficiency Power Supply

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots