Workstations

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††

1. Single socket H4 (LGA 1151) supports Intel® 7th/6th Gen. Core™ i7/i5/i3 series 2. Intel® Q270 Express Chipset 3. Up to 64GB Non-ECC UDIMM, DDR4-2400MHz, in 4 DIMM slots 4. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x4, 1 PCI-E 3.0 x1 5. 2x 5.25" drive bays, 2x 3.5" fixed drive bays, 1x 2.5" fixed drive bay 6. 1 HDMI, 1 DP, 1 DVI-D 7. HD Audio 7.1 channel connector by Realtek ALC1150, support SPDIF-Out 8. 1x 80mm Rear Fan 9. 260W 80Plus Bronze Power Supply

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. 60 Hot-swap 3.5" SAS3/SATA3 drive bays with SES3; 2 rear Hot-swap 2.5" drive bays 5. Broadcom 3008 SAS3, IT mode 6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 7. 5 Hot-swap 8cm rear exhaust PWM fans 8. 2000W Redundant Power Supplies Titanium Level (96%)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port) 4. 24 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays 5. Broadcom 3108 SAS3 AOC 6. 2x 10GBase-T LAN ports with Intel X722 + PHY Intel X557 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 3 Hot-swap 8cm redundant PWM cooling fans, 2 hot-swap 8cm rear exhaust PWM fans PWM fans 9. 1200W Redundant Power Supplies Titanium Level (96%)

X10 4U72 Ceph data node w/360TB volume and SSD.

Single Intel® Core Ultra processor up to 65W with air cooling Support for PCIe GPU accelerator cards Up to 2 ECC/Non-ECC SODIMMs supporting up to 96GB with DDR5-6400MT/s 2 RJ45 2.5GbE + 2 RJ45 10GbE LAN ports 1 PCIe 5.0 x16 LP slots

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

1. Single Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ Intel® Xeon® W-32xx processor 2. Intel® Xeon® Scalable Processors: Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots. Intel® Xeon® W-3200 Processors: Up to 2TB 3DS ECC L/RDIMM; up to 1TB 3DS L/RDIMM. (Xeon® W-3200 doesn't support DCPMM.) 3. 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16 slot) M.2 Interface: 4 PCI-E 3.0 x4, RAID 0, 1 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key 4. 1x 10GBase-T and 1x 1GbE LAN ports 5. 8 Hot-swap 3.5" SAS/SATA bay with SGPIO 6. 1 VGA port, VGA connector is dedicated for IPMI 7. 7.1 HD Audio 8. 2200W Redundant Power Supplies Titanium Level Certified

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Quad socket R1 (LGA 2011) supports Intel® Xeon® processor E7-8800 v4/v3, E7-4800 v4/v3 family (up to 24-Core) 2. Up to 2TB DDR3 (64GB LRDIMM), up to 1600MHz; 32x DIMM slots 3. 2x PCI-E 3.0 x16 FH slot; 2x PCI-E 3.0 x8 FH slot 4. Intel® i350 Dual port GbE LAN 5. I/O ports: 2x GbE LAN, 1x Dedicated LAN for IPMI Remote Management, 1x VGA, 1x COM port, 3x USB 2.0 6. 5x 3.5" Hot-swap SATA Drive Bays 7. 3x 9cm + 3x 8cm Heavy Duty fans with speed control 8. 1400W Redundant Digital PS Platinum Level (95%)