Základné dosky (motherboards)

3rd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s Intel® C621A Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 6TB Intel® Optane™ Persistent Memory 200 Series, in 16 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode. 6 PCI-E 4.0 x16, 1 PCI-E 4.0 x8 (in x4 slot) M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2280/22110, 2280/22110 M.2 Key: M-Key Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, NMI, SPM, SSM, SUM, SuperDoctor® 5, Watchdog Dual LAN with Intel® X550 10GBase-T Ethernet Controller Integrated IPMI 2.0 and KVM with Dedicated LAN 5 USB 3.0 ports, 4 USB 2.0 ports HD Audio with optical S/PDIF

1. Intel® C232 chipset 2. Up to 64GB Unbuffered ECC UDIMM DDR4 2400MHz; 4 DIMM slots 3. Expansion slots: 1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x4 (in x8), 1 PCI-E 3.0 x1

1U I/O shield for X9 socket R server MB with Gasket

Single Socket LGA-1200 (Socket H5) supported, CPU TDP support Up to 125W TDP Up to 128GB Unbuffered ECC/non-ECC UDIMM, DDR4-2933MHz, in 4 DIMM slots 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x4 (in x8 slot), 1 PCI-E 3.0 x4 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280/22110 1 M.2 E-Key CNVi/PCI-E 3.0 x1, 2230 1 VGA D-Sub Connector port, 2 DP++(Dual-Mode DisplayPort) ports, 1 DVI - D port Intel® W480 controller for 4 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Dual LAN with Intel® X550 10GBase-T Ethernet Controller Single LAN with Intel® PHY I219LM LAN controller Single LAN with Intel® Ethernet Controller I210-AT

First performance hybrid architecture from Intel 4 independent display with 4K resolution Fast AI hardware acceleration Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2

1. Intel® Xeon® processor D-1587, Single socket FCBGA 1667; 16-Core, 32 Threads, 65W 2. System on Chip 3. Up to 128GB ECC RDIMM DDR4 2133MHz or 64GB ECC/non-ECC UDIMM in 4 sockets 4. 1 PCI-E 3.0 x16

Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W, Intel® C621 Chipset, Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots

Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s Intel® C621 Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots 6 PCI-E 3.0 x16, 1 PCI-E 3.0 x4 (in x8 slot) M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, NMI, SPM, SSM, SUM, SuperDoctor® 5, Watchdog Dual LAN with Intel® X550 10GBase-T Ethernet Controller Integrated IPMI 2.0 and KVM with Dedicated LAN 5 USB 3.0 ports, 4 USB 2.0 ports HD Audio with optical S/PDIF

Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s, Intel® C622 Up to 1.5TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2666MHz,

Intel® Xeon® Processor D-2146NT, CPU TDP support 80W System on Chip Up to 256GB Registered ECC RDIMM, DDR4-2133MHz; Up to 512GB LRDIMM LRDIMM, in 4 DIMM slots 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x16 M.2 Interface: 1 PCI-E 3.0 x4 and 1 SATA/PCI-E 3.0 x2 M.2 Form Factor: 2242/2280 M.2 Key: M-Key, B-Key U.2 Interface: 2 PCI-E 3.0 x4, 2 PCI-E 3.0 NVMe x4 Internal Port(s) 1 VGA D-Sub Connector port SoC controller for 12 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Quad LAN with Intel® Ethernet Controller I350-AM4 Dual LAN with 10G SFP+ LAN via SoC Dual LAN with 10Gbase-T

1. AMD EPYC™ 8004 series Processors 2. System on Chip 3. Up to 576GB ECC RDIMM, DDR5-4800MHz in 6 DIMM slots 4. 2 PCIe 5.0 x16 via Riser Slot 1 PCIe 5.0 x 16 via Riser Slot

First performance hybrid architecture from Intel 4 independent display with 4K resolution Fast AI hardware acceleration Up to 64 EU with Intel® UHD graphics capable of 4K60 resolution Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2 High speed connectivity through dual 2.5GbE 100% wide temp grade design and components applied 12-24V wide range power with RVP and TVS Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2 Hailo-8™ powerful and efficient Edge AI solution integration ready