Základné dosky (motherboards)

1. Intel® Celeron™ J1900 (10W, 4C) 2. Intel® Silvermont microarchitecture 22nm System-on-Chip 3. Up to 8GB 1333MHz DDR3L Non-ECC SO-DIMM in 2 socket 4. 1 PCI-E x2, 1 Mini-PCI-E slot and 1 mSATA slot, 2 SATA 2.0, 4 SATA 3.0 (RAID 0, 1, 10) 5. Intel® HD Graphics with HDMI, Display port, and VGA

Key Features System on Chip Intel® Xeon® Processor D-1747NTE, CPU TDP 80W, Intel Quick Assist Technology Up to 256GB Registered ECC RDIMM, DDR4-2933MHz, in 4 DIMM slots 1 PCI-E 4.0 x16 or 2 PCI-E 4.0 x8 1 M.2 M-Key 2280 (SATA/PCI-E 3.0 x4) 1 M.2 B-Key 2280/3042/3052 (USB/SATA/PCI-E 3.0 x2) 1 M.2 E-Key 2230 (PCI-E 3.0 x1) 2 PCI-E 3.0 NVMe x4 SlimSAS Internal Port (4 SATA/PCI-E 3.0 x4) Quad 1G RJ45 with Intel® I350-AM2 and i210-IT Dual 25G SFP28 with Intel SoC SoC controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 12V DC or ATX Power Input

1. Intel® Xeon® processor D-1557, Single socket FCBGA 1667; 12-Core, 24 Threads, 45W 2. System on Chip 3. Up to 128GB ECC RDIMM DDR4 2133MHz or 64GB ECC/non-ECC UDIMM in 4 sockets 4. 1x PCI-E 3.0 x16

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 2 MCIO (PCIe5.0 x8) connectors for 4 NVMe SSDs 3 PCIe 5.0 x8, 2 PCIe 5.0 x16

2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Single Socket P (LGA 3647) supported, CPU TDP support 205W Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots Intel® C622 chipset